Nippon Micrometal Malaysia Sdn. Bhd.
Product / Service We Provide
Nature of Business
Manufacturing and sale of Au bonding wire, Cu bonding wire and micro solder ball.
Company Registration No.
201201032587 (1017075-U)
Year Established
2012
Key Persons
Director - Tadahiro Fukaya
Manager - Jason Koh
Manager - Jason Koh
Company Background
Nippon Micrometal Malaysia Sdn. Bhd. is an overseas subsidiary of Nippon Micrometal Corporation based in Malaysia, specialising in the manufacturing and sale of Au bonding Wire, Cu bonding wire and micro solder ball.
Main Shareholders / Parent Company
- Nippon Micrometal Corporation
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18-16 Menara Mutiara Sentral, No 2, Jalan Desa Aman 1 Cheras Business CentreKuala Lumpur, Kuala Lumpur, 56000, Malaysia
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+603 28562694
Distributor Required
Partnership Required
Looking to Sell
Looking to Buy
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